metallizzation/EMI-RFI SHIELDING

The process deposits a thin metallic layers that shields the interference of electromagnetic waves, EMI (ElectroMagnetic Interference) and RFI (Radio Frequency Interference)

It can be applied on the whole particular, DST (Double Side Treatment), or only some parts, SST (Selective Side Treatment)

Available on different polymeric supports: ABS, PS, PC, PEE, PC-ABS, LCP, PA6-66

Process certifiable by Underwriters Laboratories Inc. according to the needs of the customer

Final aesthetic treatment to give the metallic effect and weldability

MID (Moulded Interconnected Devices) metallization associated with the laser treatment allows to obtain selectivity required to trace the tracks on printed circuit boards.